Lĩnh vực ứng dụng

Automatic Wafer Laser Grooving Machine

Đặc điểm máy

1. Adopts specially‑customized pulse‑width laser processing tailored for wafer laser machining to improve kerf quality, with the heat‑affected‑zone (HAZ) below 2 μm

2. Multiple laser micromachining technologies are integrated to ensure processing efficiency and process quality; multiple cutting‑function selections

3. Equipped with a combined Mask‑and‑TOP‑HAT beam‑shaping module and a dual‑optical‑path processing module

4. High‑precision visual‑inspection system

5. Compatible with 8‑inch and 12‑inch wafers

6. Supports automatic loading and unloading, unattended fully‑automatic operation for mass production


Lĩnh vực ứng dụng

Laser grooving machine for Low‑k, Non‑Low‑k and GaN wafers.


Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine   Model

Automatic   Wafer Laser Grooving Machine

Wafer   Size

8inch、12inch

Processing   Speed

100mm/s~600mm/s

Processing   Accuracy

≤±3μm

Travel   Range

600mm*600mm

Laser

532nm，25W

Equipment   Utilization

＞0.95


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Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
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