Lĩnh vực ứng dụng
CD12-XC6C6D1A

Front-end Photoresist Coating and Developing System

CD12-XC6C6D1A

Đặc điểm máy

1. Stack‑type high‑throughput structure with a compact footprint

2. Equipped with a multi‑chamber shared photoresist supply system with multi‑stage back‑suction to lower photoresist consumption

3. Optional components including high‑precision hot plate, WEE and AOI units to satisfy higher standard process requirements

4. Modular‑designed core units support flexible configurations and customization

5. Satisfy factory automation demands

6. Achieves inline connection with mainstream lithography tools


Lĩnh vực ứng dụng

Applied to the processing of compound semiconductors, power devices, MEMS, RF integrated circuits and LEDs


Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine   Model

Front-end   Photoresist Coating and Developing System CD12-XC6C6D1A

Wafer   Cassette Quantity

4LP

wafer Type

Round Wafers

wafer 尺寸（mm）

200,300

Throughput（WPH）

120

Substrate   Materials

Si、Glass

Applicable   Processes

PI、I- line、Barc、SOG、SOC、KrF


Sản phẩm đề xuất
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Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
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