Lĩnh vực ứng dụng
LF12-XS3MRS1A

Photoresist Stripping Machine

LF12-XS3MRS1A

Đặc điểm máy

1. Combining tank‑soaking treatment with single‑wafer spin‑spraying to improve processing capacity

2. High‑pressure or two‑fluid spraying achieves complete photoresist stripping

3. Substrate workflow: dry‑in, wet‑transfer, dry‑out

4. Photoresist stripper is recovered, circulated, filtered and reused to reduce operating costs

5. Precious‑metal recycling function


Lĩnh vực ứng dụng

Mainly adopted for photoresist‑stripping processes of compound semiconductors, power devices, MEMS, advanced packaging, RF integrated circuits, Micro‑LEDs and optical‑glass substrates


Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine   Model

Photoresist‑Stripping   Machine LF12-XS3MRS1A

Cassette   Quantity

2CS&2LP

Configuration

1Soak+1Stripper+1Cleaning

Wafer   Type

Round Wafers,   Square Wafers

Wafer   Size (mm)

50-300

Throughput（WPH）

40

Chemical   Solvents

NMP、DMSO

Substrate   Material

Si、Glass、Sapphire、GaN、GaAs、SiC、LiTaO3、Li3PO4

Applicable   Processes

Lift-Off、Stripper

Drying   Mode

Spin   Dry+N2 Dry


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Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
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