Lĩnh vực ứng dụng Ngành công nghiệp màn hình và bán dẫn

SDBG Process Laser Stealth Dicing Machine

Đặc điểm máy

1. The light‑source system developed for the properties of silicon material achieves high‑precision internal modification cutting.

2. Equipped with a far‑infrared back‑penetrating vision system for the back‑side cutting process of silicon wafers.

3. FOUP loading and high‑efficiency wafer transportation by robotic handler.

4. Industrial vision enables fast identification of wafer contour and notch.

5. Fully‑automatic operation for 12‑inch wafers.

6. Complies with SEMI standards and supports SECS‑GEM communication.


Lĩnh vực ứng dụng

It is mainly adopted for the cutting procedure during the SDBG process of thin‑chip wafers. It supports the cutting of Flash, DRAM and other wafers and is applied to Flash Memory, Memory Controller and other fields.


Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine Model

SDBG Process Laser Stealth Dicing Machine

Wafer Substrate

Si Substrate

Wafer Size

12‑inch

X-Y Travel Range

600mm×600mm

Cutting Speed

400mm-2000mm/s

Positioning Accuracy

Repositioning accuracy：±1μ   

Positioning Accuracy：±1μm

Transmission System

Load port, robot, aligner

Overall Dimensions (LxWxH)

2940mm*1600mm*2200mm


Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
Top