Lĩnh vực ứng dụng

SiC Wafer Stealth Dicing Machine

Đặc điểm máy

1. Custom‑engineered laser system; excellent dicing performance

2. Fully‑automatic production; ultra‑precision motion stage

3. High‑precision vision system with automatic alignment and auto‑focus search

4. Compatible with 4‑inch / 6‑inch wafers

5. SECS/GEM interface


Lĩnh vực ứng dụng

Stealth‑dicing machine for SiC, GaN, LT and LN wafers


Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine   Model

SiC   Wafer Stealth Dicing Machine

Wafer   Size

4inch/6inch   Wafer

Processing   Speed

400-1000mm/s

Processing   Accuracy

±1μm

Stage   Parameters

Travel   Range: 300mm×300mm
  Repositioning Accuracy: ±0.001mm
  θ-Axis Repositioning Accuracy: ±2arcsec

Laser   Parameters

Infrared

Equipment   Utilization

>98%

Mean Time Between Critical Failures   (MTBCF)

＞1000H

Yield

≥99.5%


Sản phẩm đề xuất
Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
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